SMD - Surface Mounting | THT - Through-Hole Technology
We offer comprehensive contractual electronic contracting services based on the assembly documentation provided to us. We make both automatic surface mounting of SMD components, as well as THT and mixed cross-linked assembly.
We will develop both prototype modules and whole production batches for you. At the end of the production process, we perform functional tests to verify the correctness of the assembled electronics. Our strengths are: the many years of experience and full commitment of our team of employees. Our innovative technology and top-of-the-line production equipment enable us to quickly execute even complex projects.
We are entrusted with the full confidentiality of the technical documentation entrusted to us.
WE HAVE MODERN, EFFICIENT MOUNTING EQUIPMENT:
Printer: GRP SR2700
- Maximum tile dimensions: (L) 420 x (W) 420 mm
- Maximum frame size: (L) 650 x (W) 545 mm
- Automatic, programmable squeegees shift realized by servo
- Universal work table with tooling for attaching various types of tiles, including double sided plates
- Adjustable blade lifting speed to smoothly separate the template from the plate
- Two-blade head with independent adjustability.
Automatic: SAMSUNG SM482Elastyczny sześciogłowicowy automat do montażu elementów SMD.
- Flexible six-head automatic SMD assembly machine.
- Laying speed in acc. IPC standards - 28,000 elem./h (chip 0603)
- Dimensions of PCBs from 50 x 40mm to 460 x 400mm
- Component dimensions for standard FOV 25 from 0201 to 22 mm IC, Lead Pitch 0.4 mm, BGA,
- CSP (Ball Pitch 0.65), height up to 15mm
- Mega Pixel desktop camera with standard FOV45 x 45mm, 42 mm IC,
- Lead Pitch 0.4 mm, BGA, CSP (Ball Pitch 1 mm), MFOV (Multi Field of View) up to 55 mm, L-joints 75 mm
- 3-segment internal transporter
- Optical positioning of the markers
- Automatic suction cup changer at 37 positions.
Oven: HELLER 1707MKIIIHELLER with forced convection for brazing.
- 7 upper heating zones with balanced modules, with independent control and regulation
- Total length of heating zones: 1830mm
- 1 cooling zone with a length of 350mm
- Operating temperature 350 ° C in all zones (full compatibility with unleaded technology)
- Chain conveyor with electrical width adjustment; Length of chain pins 5 mm
- Central support system for CBS tiles
- Built-in KIC profilometer with 5 thermocouples to measure plate temperature.
AOI: Vitechnology 2K SpectroIt sets AOI standards by detecting and measuring actual process errors.
- Comprehensive pre and post reflow inspection
- 3D inspection for BGA, QFP, QFN components
- X,Y GRR < 4% on 01005 @ +/- 50 um PTW
- X, Y GRR <4% on 01005 @ +/- 50 um PTW
- Low level of false positives (up to 50 ppm)
- lInspection speed 100 cm2 / s
- 12 bit camera - 8 M Pixel CCD
- 4,75 4.75 μm with sub pixel technology..
Wave: SEHO GoWaveModern, compact wave soldering iron.
- Small but performance-oriented design that allows automatic wave soldering at relatively low cost..
- Powerful and efficient preheater,,
- iInnovative soldering area
- Current, cyclical control of the device
- Soldering width up to 340 mm
- Flexible and durable belt conveyor for processing solder frames
- Efficient control unit
- iInnovative flux module with HVLP technology (high volume - low pressure)
- High-power heater with programmable stop function
- 100% unleaded.